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AOS Semiconductor Product Reliability Report
AOD456A/AOD456AL,
Plastic Encapsulated Device
rev A
ALPHA & OMEGA Semiconductor, Inc
495 Mercury Drive Sunnyvale, CA 94085 U.S. Tel: (408) 830-9742 www.aosmd.com Oct 12, 2006
1
This AOS product reliability report summarizes the qualification result for AOD456A. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOD456A passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality.
Table of Contents:
I. II. III. IV. V. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation Quality Assurance Information
I. Product Description:
The AOD456A uses advanced trench technology and design to provide excellent RDS(ON) with low gate charge. This device is suitable for use in PWM, load switching and general purpose applications. Standard product AOD456Ais Pb-free (meets ROHS & Sony 259 specifications). AOD456AL is a Green Product ordering option. AOD456A and AOD456AL are electrically identical. Absolute Maximum Ratings TA=25C unless otherwise noted Parameter Symbol Maximum Units Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current
Avalanche Current
VDS VGS TA=25C TA=100C ID IDM IAR TA=25C TA=100C TA=25C TA=70C PD PDSM TJ, TSTG
25 20 50 50 150 30 50 25 3 2.1 -55 to 175
V V A A W W C
Power Dissipation Power Dissipation Junction and Storage Temperature Range
Thermal Characteristics Parameter Maximum Junction-toAmbient Maximum Junction-toAmbient Maximum Junction-to-Lead
Symbol T 10s SteadyState SteadyState RJA
Typ 15 41
Max 20 50 3
Units C/W C/W C/W
RJL
2.1
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II. Die / Package Information:
AOD456A Process Package Type Lead Frame Die Attach Bond wire Mold Material Filler % (Spherical/Flake) Flammability Rating Backside Metallization Moisture Level Standard sub-micron Low voltage N channel process 3 leads TO252 Copper with Ni pad Soft solder Al 5&12mils Soft solder 90/10 UL-94 V-0 Ti / Ni / Ag Up to Level 1 * AOD456AL (Green Compound) Standard sub-micron Low voltage N channel process 3 leads TO252 Copper with Ni pad Soft solder Al 5&12mils Soft solder 100/0 UL-94 V-0 Ti / Ni / Ag Up to Level 1*
Note * based on info provided by assembler and mold compound supplier
III. Result of Reliability Stress for AOD456A (Standard) & AOD456AL (Green)
Test Item Test Condition Time Point 0hr Lot Attribution Total Sample size
4675pcs
Solder Reflow Precondition
HTGB
Standard: 1hr PCT+3 cycle reflow@260c Green: 168hr 85c /85%RH +3 cycle reflow@260c Temp = 150c , Vgs=100% of Vgsmax
Standard: 26 lots Green: 3 lots
Number of Failures 0
168 / 500 hrs 1000 hrs
4 lots
328pcs 77+5 pcs / lot 328pcs 77+5 pcs / lot 1595pcs 50+5 pcs / lot 1540pcs 50+5 pcs / lot 1540pcs 50+5 pcs / lot
0
(Note A*)
4 lots
HTRB
Temp = 150c , Vds=80% of Vdsmax
168 / 500 hrs 1000 hrs
0
(Note A*)
Standard : 26 lots Green: 3 lots (Note B**) Standard : 25 lots Green: 3 lots (Note B**) Standard : 25 lots Green: 3 lots (Note B**)
HAST
130 +/- 2c , 85%RH, 33.3 psi, Vgs = 80% of Vgs max 121c , 29.7psi, 100%RH
100 hrs
0
Pressure Pot
96 hrs
0
Temperature Cycle
-65c to 150c , air to air
250 / 500 cycles
0
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III. Result of Reliability Stress for AOD456A (Standard) & AOD456AL (Green)
Continues DPA
Internal Vision Cross-section X-ray NA 5 5 5 5 40 40 40 15 5 5 5 5 40 wires 40 wires 40 wires 15 leads 0
CSAM Bond Integrity
Room Temp 150c bake 150c bake 230c
NA 0hr 250hr 500hr 5 sec
0 0
Solderability Die shear
0
150c
0hr
10
10
0
Note A: The HTGB and HTRB reliability data presents total of available AOD456A and AOD456AL burn-in data up to the published date. Note B: The pressure pot, temperature cycle and HAST reliability data for AOD456A and AOD456AL comes from the AOS generic package qualification data.
IV. Reliability Evaluation FIT rate (per billion): 32 MTTF = 3567 years
In general, 500 hrs of HTGB, 150 deg C accelerated stress testing is equivalent to 15 years of lifetime at 55 deg C operating conditions (by applying the Arrhenius equation with an activation energy of 0.7eV and 60% of upper confidence level on the failure rate calculation). AOS reliability group also routinely monitors the product reliability up to 1000 hr at and performs the necessary failure analysis on the units failed for reliability test(s). The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOD456A). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. Failure Rate = Chi2 x 109 / [2 (N) (H) (Af)] = 1.83 x 109 / [2 (4x164) (168) (258)] = 32 MTTF = 109 / FIT = 3.12 x 107hrs = 3567years Chi = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u - 1/Tj s)] Acceleration Factor ratio list:
55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C
Af
258
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann's constant, 8.617164 X 10-5eV / K
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V. Quality Assurance Information
Acceptable Quality Level for outgoing inspection: 0.1% for electrical and visual. Guaranteed Outgoing Defect Rate: < 25 ppm Quality Sample Plan: conform to Mil-Std-105D
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